THERMAL ANALYSIS OF ELECTRONIC DEVICES

About This Project

This easy-to-use interface calculates thermal distribution of a Surface-Mount Device (SMD) for several geometrical and functional configurations. Some facilities are given to set input values and carry-out final results by means of action buttons, forms to fill-in, menu, graphics and data display. Users can set solder layer thickness, materials properties and dissipated thermal power. As result, junction temperature and junction-case thermal resistance are available.